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Precautions
General Precautions at Designing, for Use and Handling
1. Circuit design precautions
(1) Check the rated performance
After checking the operation and installation environments, design the circuit so that it falls within the rated performance range
stipulated in the catalog specification.
(2) Operating temperature and ripple current
a) Set the operating temperature so that it falls within the range stipulated in the catalog specification.
b) Do not apply current that exceeds the allowable ripple current in the catalog.
(3) Leakage current
Even when the soldering conditions fall within the range of the catalog specification, the leakage current increases slightly.
It also increases slightly during high temperature no-load, moisture-proof no-load and temperature cycling tests with
no voltage applied.
In cases such as these, leakage current will decrease by applying voltage in conditions below the maximum operating temperature.
(4) Applied voltage Considerations
a) Make sure the sum of the peak DC voltage and ripple voltage values does not exceed the rated voltage.
b) Please do not apply the reverse voltage to FPCAP .
c) When the DC voltage is low, please check whether the peak value of ripple voltage does not become a reverse voltage.
(5) Reduction of failure stress
The main failure mode of the FPCAP is in the open mode primarily caused by an electrostatic capacitance drop.
Random short circuit mode failures occur rarely.
The time it takes to reach the failure mode can be extended by using the FPCAP with reduced ambient temperature,
ripple current and applied voltage.
(6) Capacitor insulation
a) Insulation is not guaranteed.
b) Be sure to completely separate the case, negative electrode terminal and positive electrode terminal from adjacent components
and PC board traces.
(7) Operating environment
Do not use the FPCAP in the following environments.
a) Places where it can come into direct contact with water or salt water and places where condensation may form.
b) Places filled with noxious gasses such as: hydrogen sulfide, sulfurous acid, nitrous acid, chlorine, ammonia, etc.
c) Places exposed to ozone, ultraviolet rays and radiation.
d) Where severe vibration or shock which exceeds the condition specified in the specification sheets.
(8) Assembly Conditions Considerations
In designing a circuit, the following conditions should be checked before the FPCAP is mounted on the PC board.
a) The pitch and diameter of PCB holes to which the FPCAP is mounted, shall be designed in conformance with the dimensional
tolerance stipulated in the catalog specifications.
(9) PC board
Avoid locating heat-generating components around the FPCAP and on the underside of the PC board under the FPCAP .
(10) Parallel connection
When used in a parallel connection with another capacitor, carefully select the type of capacitor.
(11) Other
a) Electrical characteristics are affected by fluctuations in temperature and frequency.
b) When mounting the FPCAP on a double-sided PC board, design the board so that extra PC board holes are not located
underneath the FPCAP .
2
NICHICON CORPORATION / FPCAP ELECTRONICS (SUZHOU) CO., LTD.
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